Hello, If you are patterning the seed layer before electroplating, I expect overshooting of the electroplating current density at some points. This may increase the stress of the electroplated metal at some regions, which may be the cause of the peeling off. If you can switch to a process where you can pattern the seed layer after electroplating, you may consider that process. Moreover, if the adhesion of Cr/Au is not good, you have to check the conditions of the coating of the seed layer. Vacuum level, humidity on the substrate, contaminations in the chamber are the sources of the poor adhesion. You may also consider a quick BHF dip before coating for your quartz substrate to increase the surface roughness to get better adhesion. Best regards, Kagan -- Kagan Topalli Postdoctoral Researcher ElectroScience Laboratory The Ohio State University 1320 Kinnear Road Columbus, Ohio 43212 http://www.electroscience.osu.edu/ e-mail: topalli.1@osu.edu -- On 2:59 PM, Sheng Zhang wrote: > Hi, All, > > I'm having trouble electroplating Au onto Cr/Au (15nm/55nm) seed layer > on quartz substrate. I used lift off process to pattern the metal, and > the patterns are fine after lift off. But when electroplating, the > pattern comes off (in one piece, so definitely an adhesion problem). > Does the electroplating solution or temperature affect adhesion? > > Any advice would be greatly appreciated! > > Thanks!