Hi Sheng,

You need to include one important piece of information.
What is the interface that the adhesion failed?
When you peel back the gold what material is on the back?

Regards,
Dave


David Roberts (Wafer Plating Specialist)
Prodigy Surface Tech (408) 469-3203 cell
807 Aldo Ave., Suite 103
Santa Clara, CA 95054
Phone (408) 492-9390
FAX (408) 492-9391

-----Original Message-----
From: Sheng Zhang [mailto:szhangut@gmail.com]
Sent: Tuesday, March 08, 2011 3:20 PM
To: General MEMS discussion
Subject: [mems-talk] Cr/Au peel off when electroplating?

Hi, All,

I'm having trouble electroplating Au onto Cr/Au (15nm/55nm) seed layer
on quartz substrate. I used lift off process to pattern the metal, and
the patterns are fine after lift off. But when electroplating, the
pattern comes off (in one piece, so definitely an adhesion problem).
Does the electroplating solution or temperature affect adhesion?

Any advice would be greatly appreciated!

Thanks!