Hi Sheng,

You got your answer.
Your adhesion problem is at the SiOx / Cr interface.
This is a seed deposition problem.

If the plated stress was so high to cause adhesion failure, your substrate
would be torn apart.

This is not a plating problem.
DR


David Roberts (Wafer Plating Specialist)
Prodigy Surface Tech (408) 469-3203 cell
807 Aldo Ave., Suite 103
Santa Clara, CA 95054
Phone (408) 492-9390
FAX (408) 492-9391

-----Original Message-----
From: Sheng Zhang [mailto:szhangut@gmail.com]
Sent: Thursday, March 10, 2011 7:44 PM
To: General MEMS discussion
Subject: Re: [mems-talk] Cr/Au peel off when electroplating?

I believe the metal pattern peeled off all together from the quartz
substrate.

And for your reference, my current density is pretty low, around 1
mA/cm2, and I need a thickness of 5um, so I plated for about one and a
half hour. Is it possible that putting the sample in the warm
electrolyte for that long would cause lamination?

Thanks!
Sheng