durusmail: mems-talk: Adhesion problem during 7740 glass wafer wet etching process
Adhesion problem during 7740 glass wafer wet etching process
2010-12-13
2010-12-13
2010-12-13
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Adhesion problem during 7740 glass wafer wet etching process
Ned Flanders
2010-12-15
My experience is exactly the opposite, sputtered Cr having less
pinholes than evaporated.

On 12/13/10, Andrew Sarangan  wrote:
> Most likely Cr has pin holes in the film and the HF is penetrating
> through it. Sputtered Cr is particularly prone to developing pin
> holes. I've had better luck with evaporated Cr.
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