durusmail: mems-talk: Adhesion problem during 7740 glass wafer wet etching process
Adhesion problem during 7740 glass wafer wet etching process
2010-12-13
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Adhesion problem during 7740 glass wafer wet etching process
Andrew Sarangan
2010-12-16
You can try adjusting the argon pressure. Low pressure tends to give
dense films with compressive strain which can lead to buckle
delamination.


On Tue, Dec 14, 2010 at 12:44 AM, Xin Yan  wrote:
> thank you Andrew,  I also think the sputtering Cr film should have lots of
> problem. But the Sputtering is the only way to deposit Cr in our lab.  i
> think what if i  change the recipe of the sputtering, the film could become
> more dense.
>
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