Mehmet,
your problem is the combination of thickness combined with HDMS.

Potential Solution:
Have a list of the properties of the HDMS and find a compound that will not
insist to stick to the matter for a very long time, which means you have to
conduct experiments with various solutions under tightly controlled
environments.

All the best of luck to you, I hope that my observation was a little
insightful,

On Mon, Sep 21, 2015 at 5:24 AM, Mehmet Yilmaz 
wrote:

> Dear mems-talk community,
> If I use HMDS as adhesion layer, I am having a problem with the development
> of a photoresist called AZ4562 (about 10 micron thickness). In addition, I
> am having the same development problem with AZ5214E (about 1.4 micron
> thickness).
>
> If I do not use HMDS, the development time is usually about 60 seconds, or
> even less. However, if I use HMDS, the development time goes up to 45
> minutes (not seconds...) and still the development is not successful, but
> the resist is completely removed from some parts of the patterned areas on
> the wafer.
>
> Also, I have seen this problem with different substrates such as Silicon,
> Quartz, and Pyrex.
>
> I am wondering what would be the reason for that? Is it possible that HMDS
> is old, and out of date? Could that explain the problem? Or, do you have
> any other comments based on your own experience? Could you please comment?
>
> I am looking forward to your replies.
>
> Thanks in advance,
>
> Mehmet
>
> Mechanical Engineer
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