Dear all,
Thanks for all of your replies. I could not reply earlier. I am sorry about
that.
@ Bill Moffat, I am using HMDS (UN3286) from TECHNIC FRANCE. I use HMDS
spinning rather than Vacuum Prime Oven. We do not Vacuum Prime Oven here.
What I realized is, spinning HMDS is not recommended by the vendor... But,
I do not have any other way to coat HMDS in our facilities.
@ André Bödecker, James Guenes, Liang Zhao, I looked at the datasheet. It
does not recommend spinning HMDS. I was not aware of that due to my earlier
experience with HMDS at other cleanroom facilities...
http://www.microchemicals.com/products/adhesion_promotion/hmds.html
@ Mohammad Yusuf Mulla, thanks for the recipe.
@ Orozaliev Ajymurat Nurdinovich, thanks for the information.
I have a quartz substrate that I need to work with. I will try to clean it
at first, and then skip HMDS adhesion layer spinning, since it is not
recommended by the vendor. I will let you know once I have a run-path for
this problem.
Regards,
Mehmet
On Fri, Sep 25, 2015 at 11:29 AM, Orozaliev Ajymurat Nurdinovich <
ajymurat@gmail.com> wrote:
> Mehmet,
>
> HMDS shouldn't have an effect on development time since it is only a single
> layer.
> I would check the baking temperature and time.
> Also, if you are using the YES oven, try to coat the resist after the wafer
> temperature reduces to room temperature.
>
> I sometimes do not use HMDS at all. Instead I bake the wafer at 200 C for 5
> mins and after it cools down I immediately coat my resist and I do not have
> an adhesion problem.
>
> good luck,
> Ajy
>
>
>
> On Thu, Sep 24, 2015 at 4:21 PM, James Guenes
> wrote:
>
> > Mehmet,
> > your problem is the combination of thickness combined with HDMS.
> >
> > Potential Solution:
> > Have a list of the properties of the HDMS and find a compound that will
> not
> > insist to stick to the matter for a very long time, which means you have
> to
> > conduct experiments with various solutions under tightly controlled
> > environments.
> >
> > All the best of luck to you, I hope that my observation was a little
> > insightful,
> >
> > On Mon, Sep 21, 2015 at 5:24 AM, Mehmet Yilmaz >
> > wrote:
> >
> > > Dear mems-talk community,
> > > If I use HMDS as adhesion layer, I am having a problem with the
> > development
> > > of a photoresist called AZ4562 (about 10 micron thickness). In
> addition,
> > I
> > > am having the same development problem with AZ5214E (about 1.4 micron
> > > thickness).
> > >
> > > If I do not use HMDS, the development time is usually about 60 seconds,
> > or
> > > even less. However, if I use HMDS, the development time goes up to 45
> > > minutes (not seconds...) and still the development is not successful,
> but
> > > the resist is completely removed from some parts of the patterned areas
> > on
> > > the wafer.
> > >
> > > Also, I have seen this problem with different substrates such as
> Silicon,
> > > Quartz, and Pyrex.
> > >
> > > I am wondering what would be the reason for that? Is it possible that
> > HMDS
> > > is old, and out of date? Could that explain the problem? Or, do you
> have
> > > any other comments based on your own experience? Could you please
> > comment?
> > >
> > > I am looking forward to your replies.
> > >
> > > Thanks in advance,
> > >
> > > Mehmet
> > >
> > > Mechanical Engineer
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> >
> > --
> > James Guenes
> > Electrical, Controls, Integration, Automation, Systems, Research,
> Reverse,
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