Dear mems-talk community,
I am using "DENKA T-80HW-23A" dicing saw tape to dice MEMS chips from full
4" silicon wafers.

My integration process does not allow me to mechanically peel the diced
tape from the diced MEMS chips. So, I tried acetone to remove the dicing
saw tape (DENKA T-80HW-23A) pieces from the silicon surface of the MEMS
chips. The pieces of dicing tape are removed from the MEMS chips, however,
I realized that, there are very thin layers of residues left on the silicon
surface of the MEMS chips that I cannot remove with acetone.

After drying the MEMS chips with nitrogen blowing, I tried O2 plasma clean
to remove the remaining residues. Most of the residues are gone, but there
are still some residues left that I need to remove.

Could you please let me know how to remove these thin residues of the
dicing saw tape (DENKA T-80HW-23A) from silicon surface?

Thanks in advance,
Sincerely,

Mehmet
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