Dear Mehmet,

I would recommend the usage of a non-polar solvent like petrol ether or
cyclohexane.
Regards,
André

-----Ursprüngliche Nachricht-----
Von: Mehmet Yilmaz [mailto:mehmetyilmaztr@gmail.com]
Gesendet: Mittwoch, 22. März 2017 13:47
An: General MEMS discussion
Betreff: Re: [mems-talk] Removal of dicing tape (DENKA T-80HW-23A) residues
from silicon surface of MEMS chips

Dear mems-talk community,
I just wanted to let you know that Piranha cleaning worked fine. Dicing saw
tape residues are completely removed from one of my trial MEMS chips.

I you have some other suggestions that does not require Piranha clean,
please let me know your suggestions. I would be really interested in trying
a residue removal technique that does not require Piranha cleaning.

Thanks in advance,
Sincerely,

Mehmet

On Tue, Mar 21, 2017 at 9:56 PM, Mehmet Yilmaz 
wrote:

> Dear mems-talk community,
> I am using "DENKA T-80HW-23A" dicing saw tape to dice MEMS chips from
> full 4" silicon wafers.
>
> My integration process does not allow me to mechanically peel the
> diced tape from the diced MEMS chips. So, I tried acetone to remove
> the dicing saw tape (DENKA T-80HW-23A) pieces from the silicon surface
> of the MEMS chips. The pieces of dicing tape are removed from the MEMS
> chips, however, I realized that, there are very thin layers of
> residues left on the silicon surface of the MEMS chips that I cannot
remove with acetone.
>
> After drying the MEMS chips with nitrogen blowing, I tried O2 plasma
> clean to remove the remaining residues. Most of the residues are gone,
> but there are still some residues left that I need to remove.
>
> Could you please let me know how to remove these thin residues of the
> dicing saw tape (DENKA T-80HW-23A) from silicon surface?
>
> Thanks in advance,
> Sincerely,
>
> Mehmet
>
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