Dear mems-talk community, I just wanted to let you know that Piranha cleaning worked fine. Dicing saw tape residues are completely removed from one of my trial MEMS chips. I you have some other suggestions that does not require Piranha clean, please let me know your suggestions. I would be really interested in trying a residue removal technique that does not require Piranha cleaning. Thanks in advance, Sincerely, Mehmet On Tue, Mar 21, 2017 at 9:56 PM, Mehmet Yilmazwrote: > Dear mems-talk community, > I am using "DENKA T-80HW-23A" dicing saw tape to dice MEMS chips from full > 4" silicon wafers. > > My integration process does not allow me to mechanically peel the diced > tape from the diced MEMS chips. So, I tried acetone to remove the dicing > saw tape (DENKA T-80HW-23A) pieces from the silicon surface of the MEMS > chips. The pieces of dicing tape are removed from the MEMS chips, however, > I realized that, there are very thin layers of residues left on the silicon > surface of the MEMS chips that I cannot remove with acetone. > > After drying the MEMS chips with nitrogen blowing, I tried O2 plasma clean > to remove the remaining residues. Most of the residues are gone, but there > are still some residues left that I need to remove. > > Could you please let me know how to remove these thin residues of the > dicing saw tape (DENKA T-80HW-23A) from silicon surface? > > Thanks in advance, > Sincerely, > > Mehmet > _______________________________________________ Hosted by the MEMS and Nanotechnology Exchange, the country's leading provider of MEMS and Nanotechnology design and fabrication services. Visit us at http://www.mems-exchange.org Want to advertise to this community? See http://www.memsnet.org To unsubscribe: http://mail.mems-exchange.org/mailman/listinfo/mems-talk