Hi Mehmet,
IPA works well to remove adhesive redsidue, you should try that and finish
with an 180 second O2 clean.
There's 91% IPA that is sold at local drug stores and the 99% IPA which is
used by industry which should work well.
Other that acetone is not very great. Try IPA...
Best regards,
April Lujan
Manufacturing Technician
On Fri, Apr 21, 2017 at 8:37 AM, mercado wrote:
> Hi Mehmet,
>
> Yes, try with Piranha clean, serveral times if it's necessary.
>
> Best,
>
> Dante Mercado
>
> El 2017-04-20 01:10, Sangwook Chu escribió:
>
>> Hi Mehmet,
>>
>> Can you try Piranha clean? I am not sure what materials you have on your
>> chip but it should work great for removing organic residues.
>>
>> Best,
>> Sangwook
>>
>> On Wed, Apr 19, 2017 at 11:33 PM Mehmet Yilmaz
>> wrote:
>>
>> Dear mems-talk community,
>>> I am using "DENKA T-80HW-23A" dicing saw tape to dice MEMS chips from
>>> full
>>> 4" silicon wafers.
>>>
>>> My integration process does not allow me to mechanically peel the diced
>>> tape from the diced MEMS chips. So, I tried acetone to remove the dicing
>>> saw tape (DENKA T-80HW-23A) pieces from the silicon surface of the MEMS
>>> chips. The pieces of dicing tape are removed from the MEMS chips,
>>> however,
>>> I realized that, there are very thin layers of residues left on the
>>> silicon
>>> surface of the MEMS chips that I cannot remove with acetone.
>>>
>>> After drying the MEMS chips with nitrogen blowing, I tried O2 plasma
>>> clean
>>> to remove the remaining residues. Most of the residues are gone, but
>>> there
>>> are still some residues left that I need to remove.
>>>
>>> Could you please let me know how to remove these thin residues of the
>>> dicing saw tape (DENKA T-80HW-23A) from silicon surface?
>>>
>>> Thanks in advance,
>>> Sincerely,
>>>
>>> Mehmet
>>> _______________________________________________
>>> Hosted by the MEMS and Nanotechnology Exchange, the country's leading
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>>> --
>> Sangwook Chu
>>
>> Ph.D Student
>> MEMS Sensors and Actuators Laboratory
>> Department of Electrical and Computer Engineering
>> University of Maryland
>> College Park, MD, USA
>> Tel: +1-301-405-1897
>> Cel: +1-301-332-9260
>> Email: swchu@umd.edu
>> _______________________________________________
>> Hosted by the MEMS and Nanotechnology Exchange, the country's leading
>> provider of MEMS and Nanotechnology design and fabrication services.
>> Visit us at http://www.mems-exchange.org
>>
>> Want to advertise to this community? See http://www.memsnet.org
>>
>> To unsubscribe:
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>>
> _______________________________________________
> Hosted by the MEMS and Nanotechnology Exchange, the country's leading
> provider of MEMS and Nanotechnology design and fabrication services.
> Visit us at http://www.mems-exchange.org
>
> Want to advertise to this community? See http://www.memsnet.org
>
> To unsubscribe:
> http://mail.mems-exchange.org/mailman/listinfo/mems-talk
>
_______________________________________________
Hosted by the MEMS and Nanotechnology Exchange, the country's leading
provider of MEMS and Nanotechnology design and fabrication services.
Visit us at http://www.mems-exchange.org
Want to advertise to this community? See http://www.memsnet.org
To unsubscribe:
http://mail.mems-exchange.org/mailman/listinfo/mems-talk