durusmail: mems-talk: Removal of dicing tape (DENKA T-80HW-23A) residues from silicon surface of MEMS chips
Removal of dicing tape (DENKA T-80HW-23A) residues from silicon surface of MEMS chips
2017-04-19
Removal of dicing tape (DENKA T-80HW-23A) residues from silicon surface of MEMS chips
2017-04-19
Removal of dicing tape (DENKA T-80HW-23A) residues from silicon surface of MEMS chips
2017-04-20
Removal of dicing tape (DENKA T-80HW-23A) residues from silicon surface of MEMS chips
Sangwook Chu
2017-04-20
Hi Mehmet,

Can you try Piranha clean? I am not sure what materials you have on your
chip but it should work great for removing organic residues.

Best,
Sangwook

On Wed, Apr 19, 2017 at 11:33 PM Mehmet Yilmaz 
wrote:

> Dear mems-talk community,
> I am using "DENKA T-80HW-23A" dicing saw tape to dice MEMS chips from full
> 4" silicon wafers.
>
> My integration process does not allow me to mechanically peel the diced
> tape from the diced MEMS chips. So, I tried acetone to remove the dicing
> saw tape (DENKA T-80HW-23A) pieces from the silicon surface of the MEMS
> chips. The pieces of dicing tape are removed from the MEMS chips, however,
> I realized that, there are very thin layers of residues left on the silicon
> surface of the MEMS chips that I cannot remove with acetone.
>
> After drying the MEMS chips with nitrogen blowing, I tried O2 plasma clean
> to remove the remaining residues. Most of the residues are gone, but there
> are still some residues left that I need to remove.
>
> Could you please let me know how to remove these thin residues of the
> dicing saw tape (DENKA T-80HW-23A) from silicon surface?
>
> Thanks in advance,
> Sincerely,
>
> Mehmet
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--
Sangwook Chu

Ph.D Student
MEMS Sensors and Actuators Laboratory
Department of Electrical and Computer Engineering
University of Maryland
College Park, MD, USA
Tel: +1-301-405-1897
Cel: +1-301-332-9260
Email: swchu@umd.edu 
_______________________________________________
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