durusmail: mems-talk: Removal of dicing tape (DENKA T-80HW-23A) residues from silicon surface of MEMS chips
Removal of dicing tape (DENKA T-80HW-23A) residues from silicon surface of MEMS chips
2017-04-19
Removal of dicing tape (DENKA T-80HW-23A) residues from silicon surface of MEMS chips
2017-04-19
Removal of dicing tape (DENKA T-80HW-23A) residues from silicon surface of MEMS chips
2017-04-20
Removal of dicing tape (DENKA T-80HW-23A) residues from silicon surface of MEMS chips
2017-05-01
-|EXT|- Re: Removal of dicing tape (DENKA T-80HW-23A) residues from silicon surface of MEMS chips
2017-05-04
2017-05-05
Removal of dicing tape (DENKA T-80HW-23A) residues from silicon surface of MEMS chips
Orozaliev Ajymurat Nurdinovich
2017-05-01
I use sonication in acetone followed by IPA and it works fine.
Also, I coat the surface with resist film (AZ5214E,~3 um)  and upon
removing the cut chips, the resist film remains on the tape and I have
clean Si surface (I don't use any adhesion promoter for coating the
resist.) But nevertheless I clean the surface using acetone and IPA.

On Thu, Apr 20, 2017 at 8:10 AM, Sangwook Chu  wrote:

> Hi Mehmet,
>
> Can you try Piranha clean? I am not sure what materials you have on your
> chip but it should work great for removing organic residues.
>
> Best,
> Sangwook
>
> On Wed, Apr 19, 2017 at 11:33 PM Mehmet Yilmaz 
> wrote:
>
> > Dear mems-talk community,
> > I am using "DENKA T-80HW-23A" dicing saw tape to dice MEMS chips from
> full
> > 4" silicon wafers.
> >
> > My integration process does not allow me to mechanically peel the diced
> > tape from the diced MEMS chips. So, I tried acetone to remove the dicing
> > saw tape (DENKA T-80HW-23A) pieces from the silicon surface of the MEMS
> > chips. The pieces of dicing tape are removed from the MEMS chips,
> however,
> > I realized that, there are very thin layers of residues left on the
> silicon
> > surface of the MEMS chips that I cannot remove with acetone.
> >
> > After drying the MEMS chips with nitrogen blowing, I tried O2 plasma
> clean
> > to remove the remaining residues. Most of the residues are gone, but
> there
> > are still some residues left that I need to remove.
> >
> > Could you please let me know how to remove these thin residues of the
> > dicing saw tape (DENKA T-80HW-23A) from silicon surface?
> >
> > Thanks in advance,
> > Sincerely,
> >
> > Mehmet
> > _______________________________________________
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> --
> Sangwook Chu
>
> Ph.D Student
> MEMS Sensors and Actuators Laboratory
> Department of Electrical and Computer Engineering
> University of Maryland
> College Park, MD, USA
> Tel: +1-301-405-1897
> Cel: +1-301-332-9260
> Email: swchu@umd.edu 
> _______________________________________________
> Hosted by the MEMS and Nanotechnology Exchange, the country's leading
> provider of MEMS and Nanotechnology design and fabrication services.
> Visit us at http://www.mems-exchange.org
>
> Want to advertise to this community?  See http://www.memsnet.org
>
> To unsubscribe:
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_______________________________________________
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