It is a classic problem of the surface being too hydrophilic. HF penetrates the resist/substrate interface and lifts everything off. You need to prime the substrate to reduce the water droplet contact angle to about 60-70deg, and then apply the resist. On Wed, Jun 8, 2016 at 1:43 PM, Maksym Plakhotnyukwrote: > Hi All > > I face a problem of keeping AZ5214e photoresist on top of Al2O3 film > during BHF etch. > I have done post bake of PR at 150C for 30 min however it still does not > help. > Does any of you know the solution or any idea how to keep PR On top of > alumina during BHF etch? > > Thank you in advance > > Best regards > Maksym Plakhotnyuk > PHD student at DTU > > > _______________________________________________ > Hosted by the MEMS and Nanotechnology Exchange, the country's leading > provider of MEMS and Nanotechnology design and fabrication services. > Visit us at http://www.mems-exchange.org > > Want to advertise to this community? See http://www.memsnet.org > > To unsubscribe: > http://mail.mems-exchange.org/mailman/listinfo/mems-talk > _______________________________________________ Hosted by the MEMS and Nanotechnology Exchange, the country's leading provider of MEMS and Nanotechnology design and fabrication services. Visit us at http://www.mems-exchange.org Want to advertise to this community? See http://www.memsnet.org To unsubscribe: http://mail.mems-exchange.org/mailman/listinfo/mems-talk