Mr. Lu,

Thanks for the information. I am trying to etch 200u+ deep channels. Does
crystal bonding work to this depth? I attempted thermal grease but local
heating effects etched the photoresist away quickly in certain parts. Would
you be able to comment on the sidewall angle for the structures you had
etched?

Thanks
Shree


On Wed, Dec 5, 2012 at 3:57 PM, Felix Lu  wrote:

> HI Shree,
>
>   Crystal bonding wax applied liberally over the backside of the wafers
> has worked nicely for me in the past. It dissolves in acetone. You can heat
> up the bonded wafers after DRIE and slide them apart, then soak them in
> acetone.
>
> Good luck!
>
> Felix Lu
> Applied Quantum Technologies, Inc.
>
> On Dec 5, 2012, at 10:36 AM, Shree Narayanan wrote:
>
> > Hello all,
> >
> > I need to mount a 4" silicon wafer on a 6" metallized carrier wafer, in
> > order to etch it in a Alcatel deep-reactive ion etcher. I am wondering if
> > someone has used thermal vacuum grease for this purpose that can be
> removed
> > easily at the end. The silicon wafer is patterned with photoresist and
> has
> > no other material on it.
> >
> > Thanks
> > Shree
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> ----------------------------
> Felix Lu
> felix_lu@yahoo.com
>
>
>
>
> _______________________________________________
> Hosted by the MEMS and Nanotechnology Exchange, the country's leading
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