Hi, Shree, I have tried with spin coated 2.2um photoresist on a 4 inch silicon carrier wafer, then bond the device wafer with the carrier wafer on a 120 degree hot plate. The resist is AZ5214. I have tried with etch depth around 100um. For deeper etching, I typically firstly etch it without carrier wafer to 80% depth then go further with a carrier. Do you have structures with high step on the back side of your wafer? If so, you can get little help with grease for better heat transfer. The only thing you can try is to modify your etching recipe with lower power and maybe also with some standby steps every a few minutes. Best regards, Fei 发自我的 iPad 在 2012-12-12,上午12:45,Shree Narayanan写道: > Dr. Wang, > > Appreciate your response. A quick question on whether you have attempted to > etch down to 200um. I had difficulty even with thermal grease. There seems > to be local heating effects that cause the photoresist to be eaten away > completely. > Could you give me more information on which photoresist you used and how > this was applied on the backside of the wafer. > > > Shree > > > > On Tue, Dec 11, 2012 at 9:49 AM, Fei Wang wrote: > >> Hi, Shree, >> >> Why not just use the photoresist? It works well for me. >> >> Best regards, >> Fei >> >> 2012/12/5 Shree Narayanan : >>> Hello all, >>> >>> I need to mount a 4" silicon wafer on a 6" metallized carrier wafer, in >>> order to etch it in a Alcatel deep-reactive ion etcher. I am wondering if >>> someone has used thermal vacuum grease for this purpose that can be >> removed >>> easily at the end. The silicon wafer is patterned with photoresist and >> has >>> no other material on it. >>> >>> Thanks >>> Shree >>> _______________________________________________ >>> Hosted by the MEMS and Nanotechnology Exchange, the country's leading >>> provider of MEMS and Nanotechnology design and fabrication services. >>> Visit us at http://www.mems-exchange.org >>> >>> Want to advertise to this community? See http://www.memsnet.org >>> >>> To unsubscribe: >>> http://mail.mems-exchange.org/mailman/listinfo/mems-talk >> >> >> >> -- >> Best regards, >> Yours sincerely >> Fei Wang >> ______________ >> Assistant Professor, Dr >> MIC - Department of Micro and Nanotechnology >> Technical University of Denmark (DTU) >> Building 344, 1st floor, Room no. 130 >> DK-2800, Kgs. Lyngby >> Denmark >> Tel: +45 4525 6311 >> Fax: +45 4588 7762 >> Email: fei.wang@nanotech.dtu.dk >> http://www.nanotech.dtu.dk >> _______________________________________________ >> Hosted by the MEMS and Nanotechnology Exchange, the country's leading >> provider of MEMS and Nanotechnology design and fabrication services. >> Visit us at http://www.mems-exchange.org >> >> Want to advertise to this community? See http://www.memsnet.org >> >> To unsubscribe: >> http://mail.mems-exchange.org/mailman/listinfo/mems-talk >> > _______________________________________________ > Hosted by the MEMS and Nanotechnology Exchange, the country's leading > provider of MEMS and Nanotechnology design and fabrication services. > Visit us at http://www.mems-exchange.org > > Want to advertise to this community? See http://www.memsnet.org > > To unsubscribe: > http://mail.mems-exchange.org/mailman/listinfo/mems-talk _______________________________________________ Hosted by the MEMS and Nanotechnology Exchange, the country's leading provider of MEMS and Nanotechnology design and fabrication services. Visit us at http://www.mems-exchange.org Want to advertise to this community? See http://www.memsnet.org To unsubscribe: http://mail.mems-exchange.org/mailman/listinfo/mems-talk