I will second Michael. Crystal Bond works well for deep etches up to 1mm
for me.

Leo


On Wed, Dec 12, 2012 at 11:12 AM, Michael Martin <
michael.martin@themicrowerks.com> wrote:

> Hi Shree,
>    Forgot to mention that we typically use Crystal Bond (acetone soluble)
> to bond the resist coated handle and etch wafers.  We have no problem
> etching through 500um of silicon with a 400nm oxide and a 5 um thick resist
> as masking layers.  Typical etch parameters are 15-20W of platen bias with
> 600W of coil power and helium back side cooling at 10-20 deg C.
>
> Cheers,
>     Michael
>
>
> On Tue, Dec 11, 2012 at 6:55 PM, Shree Narayanan  wrote:
>
> > Michael,
> >
> > This DRIE doesnt have DC bias but a RF bias, so metal exposure is
> allowed.
> > However, I am interested in finding a solution with photoresist as a
> mask.
> > I used thermal grease and it resulted in localized heating effects which
> > caused the PR to be eaten away quickly, in those places. Can you tell me
> if
> > 200u+ deep etches have been attempted with the PR as adhesive technique.
> > Also, do you have some information on how the cooling affects the
> sidewall
> > angle?
> >
> > Thanks
> > Shree
> >
> >
> >
> > On Thu, Dec 6, 2012 at 11:17 AM, Michael Martin <
> > michael.martin@themicrowerks.com> wrote:
> >
> > > Hi Shree,
> > >    First, a lot of fab's do not like for metal (as is on your handle
> > wafer)
> > > to be exposed to the plasma of the DRIE.  The metal will sputter,
> > redeposit
> > > on your etched structures (and the ceramic inside the DRIE) and cause
> > > micromasking.  This can lead to grass formation in your etched area.
> > >   We have used silver loaded thermal grease in the past but have also
> > had a
> > > problem removing it after etching; particularly after etching
> completely
> > > through a wafer.  We routinely use a thick resist (SPR 220, 5-7um) on
> the
> > > back of the etch wafer and a layer of thinner resist (1827) on the
> handle
> > > wafer.  Then to release after the etch just soak both of them in
> acetone.
> > > Of course having a thick resist on the back will lower the thermal
> > > conductivity and may have some deleterious effects on side wall angle
> if
> > > you are etching deep, high aspect ratio features.
> > >
> > > Cheers,
> > >    Michael
> > >
> > >
> > >
> > > On Wed, Dec 5, 2012 at 3:24 PM, Tinka Li  wrote:
> > >
> > > > Hi Shree,
> > > >
> > > > You meant something like Fomblin oil? 1 or 2 drops on your carrier,
> > > > smear out nicely, would do the chucking perfectly. Can also easily
> > > > remove (slide) your wafer out of your carrier wafer after DRIE. BUT,
> > you
> > > > may have a little trouble in cleaning our wafer afterwards.
> > > >
> > > > Prime Wafers
> > > > Rotterdam, NL
> > > >
> > > > -----Original Message-----
> > > > From: mems-talk-bounces+t.li=primewafers.com@memsnet.org
> > > > [mailto:mems-talk-bounces+t.li=primewafers.com@memsnet.org] On
> Behalf
> > Of
> > > > Shree Narayanan
> > > > Sent: Wednesday, December 05, 2012 4:36 PM
> > > > To: General MEMS discussion
> > > > Subject: [mems-talk] Adhesive to bond onto a carrier wafer for
> etching
> > > >
> > > > Hello all,
> > > >
> > > > I need to mount a 4" silicon wafer on a 6" metallized carrier wafer,
> in
> > > > order to etch it in a Alcatel deep-reactive ion etcher. I am
> wondering
> > > > if
> > > > someone has used thermal vacuum grease for this purpose that can be
> > > > removed
> > > > easily at the end. The silicon wafer is patterned with photoresist
> and
> > > > has
> > > > no other material on it.
> > > >
> > > > Thanks
> > > > Shree
> > > > _______________________________________________
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