durusmail: mems-talk: Adhesive to bond onto a carrier wafer for etching
Adhesive to bond onto a carrier wafer for etching
2012-12-05
Shree Narayanan
2012-12-05
Tinka Li
2012-12-06
Michael Martin
2012-12-12
Shree Narayanan
2012-12-12
Michael Martin
2012-12-06
Felix Lu
2012-12-12
Shree Narayanan
2012-12-12
Bill Moffat
2012-12-12
Felix Lu
2012-12-06
Morrison, Richard H., Jr.
2012-12-12
Shree Narayanan
2012-12-12
MCNIE Mark
2012-12-07
basar bolukbas
2012-12-07
Shree Narayanan
2012-12-10
basar bolukbas
2012-12-12
Shree Narayanan
2012-12-07
Brian Stahl
2012-12-12
Shree Narayanan
2012-12-12
Brian Stahl
2012-12-11
Fei Wang
2012-12-12
Shree Narayanan
2012-12-12
Wangfei
2012-12-12
sangeeth kallatt
2012-12-07
Tang Tian
2012-12-12
Dave Roberts
2012-12-13
Xiaoguang Liu
Adhesive to bond onto a carrier wafer for etching
Michael Martin
2012-12-12
Hi Shree,
   Forgot to mention that we typically use Crystal Bond (acetone soluble)
to bond the resist coated handle and etch wafers.  We have no problem
etching through 500um of silicon with a 400nm oxide and a 5 um thick resist
as masking layers.  Typical etch parameters are 15-20W of platen bias with
600W of coil power and helium back side cooling at 10-20 deg C.

Cheers,
    Michael


On Tue, Dec 11, 2012 at 6:55 PM, Shree Narayanan  wrote:

> Michael,
>
> This DRIE doesnt have DC bias but a RF bias, so metal exposure is allowed.
> However, I am interested in finding a solution with photoresist as a mask.
> I used thermal grease and it resulted in localized heating effects which
> caused the PR to be eaten away quickly, in those places. Can you tell me if
> 200u+ deep etches have been attempted with the PR as adhesive technique.
> Also, do you have some information on how the cooling affects the sidewall
> angle?
>
> Thanks
> Shree
>
>
>
> On Thu, Dec 6, 2012 at 11:17 AM, Michael Martin <
> michael.martin@themicrowerks.com> wrote:
>
> > Hi Shree,
> >    First, a lot of fab's do not like for metal (as is on your handle
> wafer)
> > to be exposed to the plasma of the DRIE.  The metal will sputter,
> redeposit
> > on your etched structures (and the ceramic inside the DRIE) and cause
> > micromasking.  This can lead to grass formation in your etched area.
> >   We have used silver loaded thermal grease in the past but have also
> had a
> > problem removing it after etching; particularly after etching completely
> > through a wafer.  We routinely use a thick resist (SPR 220, 5-7um) on the
> > back of the etch wafer and a layer of thinner resist (1827) on the handle
> > wafer.  Then to release after the etch just soak both of them in acetone.
> > Of course having a thick resist on the back will lower the thermal
> > conductivity and may have some deleterious effects on side wall angle if
> > you are etching deep, high aspect ratio features.
> >
> > Cheers,
> >    Michael
> >
> >
> >
> > On Wed, Dec 5, 2012 at 3:24 PM, Tinka Li  wrote:
> >
> > > Hi Shree,
> > >
> > > You meant something like Fomblin oil? 1 or 2 drops on your carrier,
> > > smear out nicely, would do the chucking perfectly. Can also easily
> > > remove (slide) your wafer out of your carrier wafer after DRIE. BUT,
> you
> > > may have a little trouble in cleaning our wafer afterwards.
> > >
> > > Prime Wafers
> > > Rotterdam, NL
> > >
> > > -----Original Message-----
> > > From: mems-talk-bounces+t.li=primewafers.com@memsnet.org
> > > [mailto:mems-talk-bounces+t.li=primewafers.com@memsnet.org] On Behalf
> Of
> > > Shree Narayanan
> > > Sent: Wednesday, December 05, 2012 4:36 PM
> > > To: General MEMS discussion
> > > Subject: [mems-talk] Adhesive to bond onto a carrier wafer for etching
> > >
> > > Hello all,
> > >
> > > I need to mount a 4" silicon wafer on a 6" metallized carrier wafer, in
> > > order to etch it in a Alcatel deep-reactive ion etcher. I am wondering
> > > if
> > > someone has used thermal vacuum grease for this purpose that can be
> > > removed
> > > easily at the end. The silicon wafer is patterned with photoresist and
> > > has
> > > no other material on it.
> > >
> > > Thanks
> > > Shree
> > > _______________________________________________
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> provider of MEMS and Nanotechnology design and fabrication services.
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